OFC2026, held at the Los Angeles Convention Center in the United States, has successfully concluded after a three-day run. As a leading provider of integrated optical component solutions and optoelectronic packaging manufacturing services, TFC showcased products from multiple core technology platforms and engaged in in-person discussions with customers. 

TFC On-site at OFC2026 

Leveraging its technological expertise and vertical integration capabilities in high-speed optical engines, optoelectronic packaging and optical interconnects, the company effectively addresses the bandwidth demands of AI and high-performance computing, earning wide recognition from clients. 

Fiber Shuffle Box 

At the show, TFC premiered a variety of 2.5D high-density integration solutions. It also jointly exhibited a 400G EAM featuring a TGV substrate with OpenLight. The associated optical components are designed and manufactured by TFC, which offers full-process services covering silicon photonics packaging and integration. 

400G EAM Based on TGV Substrate 

See you at OFC in Los Angeles next year!